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The following is the Eight key words of semiconductor industry in 2020 recommended by recordtrend.com. And this article belongs to the classification: Hardware equipment industry.
Looking back on the development process of the semiconductor industry, from a small transistor more than 70 years ago to now, it has infiltrated into everyone’s life in various forms. Its rapid development speed makes Moore’s law face failure. Whether it is silicon-based semiconductor materials, or semiconductor devices such as lithography machines, or the capacity of memory chips, almost all of them face failure Problems and bottlenecks that need to be solved urgently.
In 2020, the semiconductor industry is quietly finding some key words to explain its development.
1、 Domestic substitution
Under the environment of tense Sino US relations, China’s semiconductor market is extremely hot this year. According to the data of tianyancha, as of December 2020, there are more than 60000 new chip related enterprises in China this year, with a year-on-year growth of 22.39%. At present, there are about 244000 chip related enterprises in China, and more than 20000 chip related enterprises have patents.
This is the result of the dual effects of environment and policy. It is particularly obvious that on the first anniversary of the science and technology innovation board, among the top ten companies in terms of market value, five companies, including SMIC international, Shanghai silicon industry, China micro Corporation, LanChi technology and Cambrian, belong to the semiconductor field.
In solving the problem of talent shortage, there are also some new actions: to set the integrated circuit discipline as a first-class discipline, to let undergraduate graduates graduate with “core” in the “one core for life” program, and to establish Nanjing integrated circuit University, all of which are preparing for domestic substitution.
Some industry experts also participated in the discussion of “domestic substitution”. Wei Shaojun, director of the Microelectronics Research Institute of Tsinghua University, believes that a comprehensive domestic substitution of chips is just around the corner, which is a slogan type development and will put great pressure on the government. Su Wei, general manager of China Resources Microelectronics OEM group, pointed out that “at present, the self-sufficiency rate of domestic chips is less than 30%. The development of China’s entire semiconductor industry chain has obvious shortcomings. However, in the field of power semiconductor, we can see that it takes the lead in breaking through the encirclement and narrowing the gap with the international first-class technology.”
2、 Huang’s law
At the NVIDIA 2020 GTC China Conference in December, Bill dally, chief scientist and vice president of NVIDIA Research Institute, said in his speech that if we really want to improve computer performance, Huang’s law is an important indicator and will always be applicable in the foreseeable future. This is the first time that the name “Huang’s law” has been officially recognized by NVIDIA.
Huang’s law specifically refers to the prediction made by Huang Renxun, founder of NVIDIA, on the improvement of AI performance. GPU will promote AI performance to double year by year. At the conference, Bill dally explained the key to the realization of Huang’s law with three projects, including the implementation of magnet tool for ultra-high energy efficiency accelerators, the replacement of electrical links in existing systems with faster optical links, and a new programming system prototype, gate.
Several decades ago, Gordon Moore, one of the founders of Intel, put forward the famous Moore’s law. From the perspective of economics, he successfully predicted the development trend of integrated circuits in recent decades, that is, the number and performance of transistors will double every 18 months. At present, as a hot AI chip company, NVIDIA’s Huang’s law is expected to lead the development of the chip industry in the next few decades.
3、 Wide band gap semiconductor
Wide band gap semiconductor is the third generation of semiconductor materials, including silicon carbide (SIC), gallium nitride (GAN), zinc oxide (ZnO), diamond (c), aluminum nitride (AlN) and other emerging materials. Initially, its research and development was mainly used to meet the military and national defense needs. The band gap of wide band gap semiconductor is 2.2E larger than that of silicon semiconductor, which can effectively reduce the gap of electronic crossing and reduce energy loss. Therefore, it should be used in the field of energy saving, mainly power devices. At the beginning of this year, Xiaomi launched Gan fast charging, which is a typical use case of broadband compact semiconductor.
In order to replace silicon substrate with wide band gap semiconductor, we need to overcome the cost bottleneck. The high cost of silicon carbide and gallium nitride substrate makes the cost of device 5 to 10 times higher than that of traditional silicon substrate, which is the main reason hindering the popularization of wide band gap semiconductor. However, with the improvement of technology and process, the cost is close to that of silicon-based devices.
This year, in the “fourteenth five year” planning proposals of various provinces, it is mentioned one after another to speed up the layout of third-generation semiconductor and other industries. Wide band gap semiconductor has become one of the important development directions of China’s semiconductor industry in 2020 and even in the next few years.
4、 8-inch wafer
The shortage of wafers is a common phenomenon in the semiconductor industry. However, affected by the epidemic and the growth of 5g application demand this year, the production capacity of 8-inch Fabs manufactured by each OEM is full, and the shortage is particularly serious. Huang Chongren, chairman of TSMC, summarized the current situation of wafer capacity shortage in November. He said that the current wafer capacity shortage is incredible, and the demand of customers for capacity has reached a panic level. It is expected that the logic and DRAM markets will be out of stock in the second half of next year to the second half of 2022.
The demand for analog chips and power devices continues to rise, which is squeezed by the existing few 8-inch wafer production lines, and the capacity continues to be tight. On the other hand, the production cycle of other chips or devices that need to be produced on 8-inch wafers, such as MOSFET, driver IC, power management IC, etc., is extended, and the market price rises one after another.
According to the latest research of trendforce, it is estimated that in 2020, the revenue of global wafer foundry industry will increase by 23.8% year on year, which is the highest in ten years. Advanced nodes and 8-inch production capacity become the key to the competitiveness of wafer foundry industry.
5、 EDA on cloud
If 2019 is the year when the concept of EDA on the cloud is popularized, then 2020 is the year when EDA on the cloud is explored and implemented. Both EDA software providers, IC design enterprises and OEM are practicing EDA on the cloud.
EDA on the cloud refers to designing chips through the cloud. Compared with designing chips through traditional EDA tools, EDA cloud platform has many advantages. It can adapt to the needs of EDA tools, has large-scale automatic intelligent scheduling of computing power, and provides flexible computing power support with massive cloud resources. It can directly improve the R & D cycle and yield of chips, and reduce the cost of chip design.
One of the three largest EDA providers in the world, sunthink technology has deployed cloud design and chip manufacturing platform with TSMC to help TSMC become the first generation factory to realize cloud design; after Amazon AWS acquired Annapurna labs, an Israeli chip manufacturer, its chips such as graviton and inferentia have all realized cloud development from RTL to GDSII. In China, some cloud companies, including Alibaba cloud, provide EDA model configuration. With the help of the whole project of Alibaba cloud and the server hosting scheme, pingtouge designs the cloud to achieve 10% to 50% performance improvement.
SoC design process, from Alibaba cloud Research Center & Xinsi Technology
For the future of EDA on the cloud, Xie Zhonghui, deputy general manager of Xinsi Technology China and general manager of chip Automation Division, is optimistic about its development. He believes that the cloud on chip design will lead the chip industry into a new virtuous circle, which is an opportunity for Internet and system companies that are determined to invest in chips. It will also allow traditional chip companies to no longer be limited to chip performance and power consumption, but to cooperate with users Combine scenarios closely and provide better service experience.
In the year of 5g landing, 5g chip, as an engine, can not be absent. In the mobile phone market, it also ushers in a new wave of 5g chip competition in the 5nm battlefield. Since the start of 5g chips by major chip manufacturers at the end of 2019, in 2020, chip manufacturers are more committed to the introduction of 5g chips with advanced processes below 7Nm, and upgrade from external 5g baseband to integrated SOC.
Apple first launched A14 bionic with TSMC 5nm process, which integrates 11.8 billion transistors, but still uses external high pass snapdragon 5g baseband. Since then, Huawei released Kirin 9000, becoming the world’s first 5g mobile phone SOC with 5nm process, integrating 15.3 billion transistors.
After that, Samsung released exyons 1080, which adopts its own 5nm process and 5g baseband. It has entered the flagship ranks with the design of integrated SOC, and will launch on vivo’s new machine.
Qualcomm snapdragon 888 is the last 5nm integrated 5g SOC in 2020. Its code name changes from 875 to 888, which expresses its recognition of the importance of 5g market in China. Snapdragon 888 also uses Samsung’s 5nm process to integrate the world’s first 5nm 5g baseband snapdragon X60, which can provide 5g commercial network speed up to 7.5gpbs.
This year, the competition for 5g chips is particularly fierce. As a representative of domestic chips, Kirin 9000 can compete with the international level. Unfortunately, Huawei, which is affected by Sino US relations, will not be able to participate in the next competition.
7、 3D Packaging
In order to break through the bottleneck of advanced 3D packaging technology, manufacturers are also competing for a higher degree of freedom in the development of 3D packaging technology.
TSMC announced for the first time in 2018 its system integration of single chip and multi chip 3D stacking technology, and successively launched 2.5D high-end packaging technology cowos and fan out wafer technology info, seizing Apple’s orders. This year, we will introduce advanced chip level interconnect technology (wlsi-3d) to integrate low-power, multi-functional chip system (soc-ic) and low-density package technology.
Intel also demonstrated its 3D packaging technology called “foveros” for the first time two years ago. On this year’s architecture day, it announced a new development, namely “hybrid bonding”, to replace the traditional “hot press bonding” technology, accelerate the realization of bump spacing of 10 microns and below, and provide better interconnection density, bandwidth and lower power.
Samsung announced this year that a new chip packaging technology, x-cube3d, has been put into use, allowing multiple chips to be stacked and packaged. Samsung claims that it can make chips have more powerful performance and higher energy efficiency.
8、 Integration of storage and calculation
In the era of AI algorithm’s increasing demand for computing power, the problem of “memory wall” caused by von Neumann architecture is becoming more and more obvious, that is, the physical separation of storage and calculation, which makes it necessary to continuously exchange data through the bus in the process of calculation, read data from memory to CPU, and then write it back to storage after calculation. Because the storage speed is much lower than the calculation speed, most of the time and power consumption are consumed in the bus transmission, which eventually leads to the difficulty of traditional chip computing power to keep up with the demand.
In order to solve the “memory wall” problem, memory computing integration technology based on memristor is proposed, from device research to computing paradigm research, until this year, new progress has been made.
In February this year, Professor Qian He and Professor Wu Huaqiang of Institute of microelectronics of Tsinghua University and future chip technology innovation center successfully developed a memory computing integrated system based on multi array memristor, which uses memristor to replace classic transistors, breaks the von Neumann bottleneck, and greatly improves the computing power of computing equipment with less power consumption and lower hardware cost, becoming the first memristor based system CNN memory and calculation integrated chip.
At the fifth global artificial intelligence and robotics summit 2020 (ccf-gair 2020), Gao Bin, associate professor of Tsinghua University, said that the next step of the memory computing integrated chip will be the construction of the memory computing integrated computing system. Without changing the existing language, the computing energy efficiency will be improved from 100 times to 1000 times.
Morgan Stanley: it is estimated that the overall sales of the semiconductor industry will drop by 4.7% in 2019 Gartner: the global semiconductor revenue in 2018 will reach US $476.7 billion, with a year-on-year growth of 13.4% IHS: the revenue of the semiconductor industry in 2014 will reach US $353 billion, with an increase of nearly 10% smart thing: global semiconductor industry inventory IHS in 2019 Markit: it is estimated that the global semiconductor industry will drop by nearly 13% in 2019 compared with last year. The world will enter the stock competition. The semiconductor industry will usher in a period of domestic substitution opportunities. IC insights: capital investment of the semiconductor industry in 2017 is estimated that the profits of Taiwan’s semiconductor industry are meager, struggling to survive. US semiconductor industry agreement: global semiconductor revenue in October 2013 is 27.06 billion US dollars PCAST: to ensure the long-term leading position of the United States in the semiconductor industry report (attached with download) IDC: the global semiconductor industry revenue in 2012 was 295 billion US dollars, down 2.2% PwC: China’s impact on the semiconductor industry in 2015 (attached with download) trendfocus: Q4 global mechanical hard disk shipment fell below 90 million in 2018 16% year on year JPR: 41% PC game players are using AMD processor
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